Gigabyte X570S AORUS PRO AX AM4 ATX Motherboard
- ATX Form Factor
- AMD X570 Chipset
- AM4 Socket
- 4 x Dual-Channel DDR4
Product Pricing
EMI Start From*
SPECIFICATIONS
Processor
AMD Ryzen™ 4000 G-Series Processors/ AMD Ryzen™ 3000 Series Processors/ AMD Ryzen™ 3000 G-Series Processors/
AMD Ryzen™ 2000 Series Processors/ AMD Ryzen™ 2000 G-Series Processors
Mainboard
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Memory
Dual channel memory architecture
Support for DDR4 5400(O.C.) / 5300(O.C.) / 5200(O.C.) / 5100(O.C.) / 4800(O.C.) / 4600(O.C.) / 4400(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3733(O.C.) / 3600(O.C.) / 3466(O.C) / 3400(O.C.) / 3200(O.C.) / 2933 / 2667 / 2400 / 2133 MHz memory modules
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules*
* ECC memory (ECC mode) support varies by CPU
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
Storage
AMD Ryzen™ 5000-Series/3000 Series Processors
support SATA and PCIe 4.0 x4/x2 SSDs
AMD Ryzen™ 5000 G-Series/4000 G-Series/3000 G-Series/2000 Series/ 2000 G-Series Processors
support SATA and PCIe 3.0 x4/x2 SSDs
1 x M.2 connector (M2B_SB), integrated in the Chipset, supporting Socket 3, M key, type 2242/2280/22110 SSDs:
Supporting PCIe 4.0*/3.0 x4/x2 SSDs
* For AMD Ryzen™ 5000 Series/3000 Series Processors only.
1 x M.2 connector (M2C_SB), integrated in the Chipset, supporting Socket 3, M key, type 2242/2280/22110 SSDs:
Supporting SATA and PCIe 4.0*/3.0 x4/x2 SSDs
* For AMD Ryzen™ 5000 Series/3000 Series Processors only.
6 x SATA 6Gb/s connectors, integrated in the Chipset:
Support for RAID 0, RAID 1, and RAID 10
* Refer to "1-8 Internal Connectors," for the installation notices for the M.2 and SATA connectors.
Graphics
* Support for HDMI 2.1 version, HDCP 2.3, and HDR.
Maximum shared memory of 16 GB
Networking & Connectivity
Audio & Microphone
* The back panel line out jack supports DSD audio..
Support for DTS:X® Ultra.
High Definition Audio.
2/4/5.1/7.1-channel.
Support for S/PDIF Out
Ports
AMD Ryzen™ 5000 Series/3000 Series Processors
support PCIe 4.0 x16 mode
AMD Ryzen™ 5000 G-Series/4000 G-Series/2000 Series Processors
support PCIe 3.0 x16 mode
AMD Ryzen™ 3000 G-Series/2000 G-Series Processors
support PCIe 3.0 x8 mode
1 x PCI Express x16 slot (PCIEX8), integrated in the CPU:
AMD Ryzen™ 5000 Series/3000 Series Processors
support PCIe 4.0 x8 mode
AMD Ryzen™ 5000 G-Series/4000 G-Series/2000 Series Processors
support PCIe 3.0 x8 mode
AMD Ryzen™ 3000 G-Series Processors/AMD Ryzen™ 2000 G-Series Processors do not support this slot.
* For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
* The PCIEX8 slot shares bandwidth with the PCIEX16 slot. When the PCIEX8 slot is populated, the PCIEX16 slot operates at up to x8 mode.
1 x PCI Express x16 slot (PCIEX4), integrated in the Chipset:
Supporting PCIe 4.0*/3.0 x4 mode
* For AMD Ryzen™ 5000 Series/3000 Series Processors only.
1 x 8-pin ATX 12V power connector
1 x 4-pin ATX 12V power connector
1 x CPU fan header
1 x water cooling CPU fan header
4 x system fan headers
2 x system fan/water
cooling pump headers
2 x addressable LED strip headers
2 x RGB LED strip headers
1 x CPU cooler LED strip/RGB LED strip header
3 x M.2 Socket 3 connectors
6 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x USB Type-C® header, with USB 3.2 Gen 2 support
2 x USB 3.2 Gen 1 headers
2 x USB 2.0/1.1 headers
1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
1 x Thunderbolt™ add-in card connector
1 x Clear CMOS jumper
2 x temperature sensor headers
2 x SMA antenna connectors (2T2R)
1 x HDMI port
1 x USB Type-C® port, with USB 3.2 Gen 2x2 support
4 x USB 3.2 Gen 2 Type-A ports (red)
3 x USB 3.2 Gen 1 ports
1 x RJ-45 port
1 x optical S/PDIF Out connector
5 x audio jacks
3 x USB 3.2 Gen 1 ports on the back panel
Chipset+ASMedia® USB 3.2 Gen 2x2 Controller:
1 x USB Type-C® port on the back panel, with USB
3.2 Gen 2x2 support
Chipset:
1 x USB Type-C® port with USB 3.2 Gen 2 support, available
through the internal USB header
3 x USB 3.2 Gen 2 Type-A ports (red) on the back panel
4 x USB 3.2 Gen 1 ports available through the internal USB headers
Chipset+2 USB 2.0 Hubs:
8 x USB 2.0/1.1 ports (4 ports on the back panel,
4 ports available through the internal USB headers)
Software
cFosSpeed
Special Features
* Available applications in APP Center may vary by motherboard model. Supported functions of each applicationmay also vary depending onmotherboard specifications.
@BIOS
EasyTune
Fast Boot
Game Boost
ON/OFF Charge
RGB Fusion
Smart Backup
System Information Viewer
Support for Q-Flash Plus
Support for Q-Flash
Support for Xpress Install
Others
iTE® I/O Controller Chip
H/W Monitoring
Voltage detection
Temperature detection
Fan speed detection
Water cooling flow rate detection
Overheating warning
Fan fail warning
Fan speed control
* Whether the fan (pump) speed control function is supported will depend on the fan (pump) you install.
Physical Specification
Warranty Information
DESCRIPTION
Gigabyte X570S AORUS PRO AX AM4 ATX Motherboard
UNPARALLELED PERFORMANCE
To unleash the full potential of the latest AMD Ryzen™ 5000 series processors, the motherboard requires the best CPU power, memory and IO design. With the best quality components and GIGABYTE R&D design capability, X570S AORUS PRO AX is a true beast among motherboards.
1. Fins-Array II
Fins-Array II uses brand new louvered stacked-fins design which not only increases surface area by 300% compared to traditional heatsinks, but also improves thermal efficiency with better airflow and heat dissipation.
2. 2X Copper PCB
2X Copper PCBs design effectively lower the component temperature by its high thermal conductivity and low impedance.
3. Direct-Touch Heatpipe II
With an extra large 8mm heatpipe and made by a new manufacturing process which has narrowed down the gap between the heatpipe and heatsink. The new Direct-Touch Heatpipe II greatly helps to dissipate the heat on MOSFETs.
4. 9 W/mK Thermal Conductivity Pad
By using 1.5mm thicker 9 W/mK thermal conductivity pads, it can transfer 4x more of heat dissipation compared to traditional thermal pads in same time.
5. M.2 Thermal Guard III
M.2 Thermal Guard III constructed with 2.6X optimized heat dissipation surface and double-sided M.2 heatsinks to prevent throttling and bottlenecks on high-speed/ large capacity of PCIe 4.0 M.2 SSDs.
ADVANCED THERMAL SOLUTION
X570S AORUS PRO AX uses an unprecedented and innovative thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full loading application and gaming.
NEXT GENERATION CONNECTIVITY
A Flagship product needs to be future-proof so your system stays up-to-date with the latest technology. X570S AORUS PRO AX provides all next generation network, storage, and WIFI connectivity to keep you up to speed.
DEFINITIVE AESTHETICS
X570S AORUS PRO AX features RGB FUSION 2.0 to offer lighting effected options and customized settings with outstanding aesthetics, and able to let enthusiasts building a stylish and unique gaming PC.
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