MSI GeForce RTX 3070 Suprim X 8GB Graphics Card

GeForce RTX™ 3070 Suprim X 8G

The GeForce RTX™ 3070 is powered by Ampere—NVIDIA's 2nd gen RTX architecture. Built with enhanced RT Cores and Tensor Cores, new streaming multiprocessors, and high-speed G6 memory, it gives you the power you need to rip through the most demanding games.

• TORX Fan 4.0: A masterpiece of teamwork, fan blades work in pairs to create unprecedented levels of focused air pressure.
• Core Pipe: Precision-machined heat pipes ensure max contact to the GPU and spread heat along the full length of the heatsink.
• Airflow Control: Don't sweat it, Airflow Control guides the air to exactly where it needs to be for maximum cooling.
• Close Quarters Heatpipe & Heatsink: Memory modules have their own close quarters heat pipe and heatsink for dedicated cooling.
• Copper Baseplate: A solid nickel-plated copper baseplate transfers heat from the GPU to all the heat pipes.
• Dual BIOS gives you the choice to prioritize for full performance in GAMING mode or low noise in SILENT mode.
• MSI's exclusive Dragon Center software lets you monitor, tweak, and optimize MSI products in real-time.
• Controls lighting for both MSI and compatible third-party RGB products.

20 YEARS IN THE MAKING

While striving for the SUperior gaming experience, our PRofound journey across decades took us to destinations previously thought IMpossible. Across years of high-performance circuit design, MSI is proud to bring its latest masterpiece to life. SUPRIM is the next leap in graphic card design.

CHISELED TO PERFECTION

Built upon two decades of award-winning graphics cards, the time to evolve beyond Gaming has come. A new design philosophy takes shape to pave the way for a new prestigious series.

FOCUS ON WHAT’S IMPORTANT

TORX FAN 4.0 is a masterpiece built on teamwork, with pairs of fan blades linked together with a revolutionary ring design to focus airflow and air pressure into the heatsink.

FACING THE HEAT HEAD-ON

The heat from the GPU is immediately captured by a solid nickel-plated copper baseplate and then rapidly transferred to an array of heatpipes. This widening of the thermal transfer systems with highly efficient mechanisms starting at the base improves overall efficiency.